CeramTec

CeramTec at Advanced Ceramics Show: High-Performance Ceramics for Electronics, Power and Sensing

CeramTec will exhibit at the Advanced Ceramics Show in Birmingham from 8 to 9 July 2026. At Booth 230, the technical ceramics specialist presents solutions for electronics, semiconductor manufacturing and power electronics – including ceramic substrates, piezoceramic sensors and additively manufactured components.

  • Electronics: Ceramic components for semiconductor manufacturing and high-power electronics
  • Substrates: Ceramic substrates in Al₂O₃, ZTA, AlN and Si₃N₄ for power electronics and e-mobility
  • Piezoceramics: Active ceramic sensors and actuators for monitoring, control and precision motion
  • 3D Printing: Additively manufactured ceramics – complex geometries, rapid prototyping, custom solutions

 

Power densities are rising, systems are shrinking, and reliability requirements are becoming stricter. For engineers in electronics, semiconductor manufacturing and power electronics, material selection has become a competitive factor – not just a technical one. At the Advanced Ceramics Show in Birmingham from 8 to 9 July 2026, CeramTec presents ceramic solutions designed for precisely these demands. Visitors from electronics, semiconductor, power electronics and e-mobility will find relevant answers at Booth 230.

Electronics and Semiconductors: Where Ceramics Are Indispensable

Ceramic materials fulfil requirements in semiconductor manufacturing that no alternative material meets simultaneously: high purity, chemical and thermal resistance, dimensional stability and long-term reliability. CeramTec supplies high-precision components for semiconductor front-end manufacturing and metrology equipment, including wafer chucks and structural chamber parts. Advanced hard machining, grinding and lapping processes deliver defined flatness, parallelism and surface roughness – enabling consistent performance where tolerances are measured in micrometers.

As electronic systems operate at higher power densities and shrink in size, the thermal and electrical performance of ceramic materials becomes decisive. Advanced ceramics provide insulation, conductivity and mechanical stability that allow power systems to run reliably over long service lives.

Ceramic Substrates: The Foundation of Power Electronics

Ceramic substrates are a core component of power electronic modules in electric vehicles, industrial drives, wind turbines, solar inverters and charging infrastructure. They carry semiconductor chips, dissipate heat and provide electrical isolation at high voltages.

CeramTec manufactures ceramic substrates entirely within Europe, covering all four established materials: aluminium oxide (Al₂O₃), ZTA (zirconia toughened alumina), aluminium nitride (AlN) and silicon nitride (Si₃N₄) – the latter being essential for SiC- and GaN-based applications. As European one-stop shop for all four substrate materials, CeramTec reduces procurement complexity and supply chain risk. For visitors at the co-located Battery and Vehicle Electrification shows, reliable substrate supply is a direct operational concern.

Piezoceramics and Sensors: Ceramics That Act and Measure

Many exhibitors at Advanced Ceramics events focus on passive materials. CeramTec goes further. The company manufactures piezoceramic components and fully assembled sensor and transducer systems that convert mechanical input into electrical signals – or translate electrical signals into precise mechanical motion. Typical applications include ultrasonic flow measurement, condition monitoring, vibration analysis and precision actuation.

CeramTec also offers a lead-free piezoceramic alternative based on BNT-BT (bismuth sodium titanate barium titanate), meeting technical demands alongside growing regulatory and sustainability requirements. This active dimension – sensing and actuation integrated directly into a ceramic component – distinguishes CeramTec from suppliers focused solely on structural materials.

Additive Manufacturing with Ceramics

CeramTec also presents its capabilities in additive manufacturing of ceramics. 3D printing with materials such as silicon carbide (SiSiC) removes the geometric constraints of conventional processes, enabling complex internal structures, functional integration and lightweight designs. For development teams, it shortens prototyping cycles and makes customised geometries viable even in small quantities.

Visit CeramTec at Booth 230

CeramTec will be at Booth 230 at the Advanced Ceramics Show in Birmingham from 8 to 9 July 2026. Engineers and sourcing professionals from electronics, semiconductor, power electronics, e-mobility and battery sectors are welcome to discuss applications directly with the CeramTec team.

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Ceramic solutions for electronic applications – from passive components and coolers to a full range of ceramic substrates. Source: CeramTec
Complete design freedom with silicon carbide – ROCAR 3D printed semicon component. Source: CeramTec
CeramTec develops ceramic components and parts for the semiconductor industry according to their individual application requirements – here ceramic wafer polishing plates. Source: CeramTec
Lead-free piezoceramic components in different shapes, sizes and designs. Available for certain smart metering or high-power applications. Source: CeramTec
Über CeramTec
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